Details
- Title: 2019 Computing, Communications and IoT Applications (ComComAp 2019)
- Date/Location: Held 26-28 October 2019, Shenzhen, China.
- IEEE #: CFP1921R-POD
- ISBN: 9781728119748
- Pages: 468 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 Computing, Communications and IoT Applications (ComComAp 2019)
- Date/Location: Held 26-28 October 2019, Shenzhen, China.
- IEEE #: CFP1921R-POD
- ISBN: 9781728119748
- Pages: 468 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )