Details
- Title: 2019 2nd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM 2019)
- Date/Location: Held 22-24 November 2019, Shanghai, China.
- IEEE #: CFP19V71-POD
- ISBN: 9781728150468
- Pages: 789 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 2nd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM 2019)
- Date/Location: Held 22-24 November 2019, Shanghai, China.
- IEEE #: CFP19V71-POD
- ISBN: 9781728150468
- Pages: 789 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )