ELECTRICAL, ELECTRONICS ENGINEERING, INFORMATION AND COMMUNICATION TECHNOLOGIES. IEEE CHILEAN CONFERENCE. 2019. (CHILECON 2019) (2 VOLS)

ELECTRICAL, ELECTRONICS ENGINEERING, INFORMATION AND COMMUNICATION TECHNOLOGIES. IEEE CHILEAN CONFERENCE. 2019. (CHILECON 2019) (2 VOLS)

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052851
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Details

  • Title: 2019 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON 2019)
  • Date/Location: Held 13-27 November 2019, Valparaiso, Chile.
  • IEEE #: CFP19CHK-POD
  • ISBN: 9781728131863
  • Pages: 1,288 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )

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Tab 4

 
  • Title: 2019 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON 2019)
  • Date/Location: Held 13-27 November 2019, Valparaiso, Chile.
  • IEEE #: CFP19CHK-POD
  • ISBN: 9781728131863
  • Pages: 1,288 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )