Details
- Title: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC 2019)
- Date/Location: Held 1-4 November 2019, Nanjing, China.
- IEEE #: CFP19J66-POD
- ISBN: 9781728144177
- Pages: 334 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC 2019)
- Date/Location: Held 1-4 November 2019, Nanjing, China.
- IEEE #: CFP19J66-POD
- ISBN: 9781728144177
- Pages: 334 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )