INTEGRATED CIRCUITS AND MICROSYSTEMS. IEEE INTERNATIONAL CONFERENCE. 4TH 2019. (ICICM 2019) (USB)

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052767
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Details

  • Title: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)
  • Date/Location: Held 25-27 October 2019, Beijing, China.
  • IEEE #: CFP19H23-USB
  • ISBN: 9781728151311
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )

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  • Title: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)
  • Date/Location: Held 25-27 October 2019, Beijing, China.
  • IEEE #: CFP19H23-USB
  • ISBN: 9781728151311
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )