Details
- Title: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)
- Date/Location: Held 25-27 October 2019, Beijing, China.
- IEEE #: CFP19H23-POD
- ISBN: 9781728151335
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)
- Date/Location: Held 25-27 October 2019, Beijing, China.
- IEEE #: CFP19H23-POD
- ISBN: 9781728151335
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )