DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 25TH 2019. (SIITME 2019) (USB)

DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 25TH 2019. (SIITME 2019) (USB)

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052714
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Details

  • Title: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME 2019)
  • Date/Location: Held 23-26 October 2019, Cluj-Napoca, Romania.
  • IEEE #: CFP1907I-USB
  • ISBN: 9781728133294
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )

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Tab 4

 
  • Title: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME 2019)
  • Date/Location: Held 23-26 October 2019, Cluj-Napoca, Romania.
  • IEEE #: CFP1907I-USB
  • ISBN: 9781728133294
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )