Details
- Title: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME 2019)
- Date/Location: Held 23-26 October 2019, Cluj-Napoca, Romania.
- IEEE #: CFP1907I-POD
- ISBN: 9781728133317
- Pages: 426 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME 2019)
- Date/Location: Held 23-26 October 2019, Cluj-Napoca, Romania.
- IEEE #: CFP1907I-POD
- ISBN: 9781728133317
- Pages: 426 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )