Details
- Title: 2019 International Workshop of High-Performance Interconnection Networks in the Exascale and Big-Data Era (HiPNEB 2019)
- Date/Location: Held 16-20 February 2019, Washington, DC, USA.
- IEEE #: CFP19T55-POD
- ISBN: 9781728148199
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 International Workshop of High-Performance Interconnection Networks in the Exascale and Big-Data Era (HiPNEB 2019)
- Date/Location: Held 16-20 February 2019, Washington, DC, USA.
- IEEE #: CFP19T55-POD
- ISBN: 9781728148199
- Pages: 17 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2020 )