Details
- Title: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA 2019)
- Date/Location: Held 2-5 July 2019, Hangzhou, China.
- IEEE #: CFP19777-POD
- ISBN: 9781728135533
- Pages: 639 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA 2019)
- Date/Location: Held 2-5 July 2019, Hangzhou, China.
- IEEE #: CFP19777-POD
- ISBN: 9781728135533
- Pages: 639 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )