Details
- Title: 2019 IEEE Symposium on Product Compliance Engineering - Asia (ISPCE-CN 2019)
- Date/Location: Held 23-25 October 2019, Kowloon, Hong Kong.
- IEEE #: CFP19BWD-POD
- ISBN: 9781728163611
- Pages: 69 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Symposium on Product Compliance Engineering - Asia (ISPCE-CN 2019)
- Date/Location: Held 23-25 October 2019, Kowloon, Hong Kong.
- IEEE #: CFP19BWD-POD
- ISBN: 9781728163611
- Pages: 69 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )