ENGINEERING, COMPUTER AND INFORMATION SCIENCES. INTERNATIONAL MULTI-CONFERENCE. 2019. (SIBIRCON 2019) (2 VOLS)

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052248
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  • Title: 2019 International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON 2019)
  • Date/Location: Held 21-27 October 2019, Novosibirsk, Russia.
  • IEEE #: CFP1911E-POD
  • ISBN: 9781728144023
  • Pages: 1,012 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )

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Tab 4

 
  • Title: 2019 International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON 2019)
  • Date/Location: Held 21-27 October 2019, Novosibirsk, Russia.
  • IEEE #: CFP1911E-POD
  • ISBN: 9781728144023
  • Pages: 1,012 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )