Details
- Title: 2019 International Conference on Embedded Software (EMSOFT 2019)
- Date/Location: Held 13-18 October 2019, New York, New York, USA.
- IEEE #: CFP19MSO-POD
- ISBN: 9781728100197
- Pages: 26 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 International Conference on Embedded Software (EMSOFT 2019)
- Date/Location: Held 13-18 October 2019, New York, New York, USA.
- IEEE #: CFP19MSO-POD
- ISBN: 9781728100197
- Pages: 26 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2020 )