Details
- Title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC 2019)
- Date/Location: Held 16-19 September 2019, Pisa, Italy.
- IEEE #: CFP1954H-POD
- ISBN: 9781728162911
- Pages: 662 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC 2019)
- Date/Location: Held 16-19 September 2019, Pisa, Italy.
- IEEE #: CFP1954H-POD
- ISBN: 9781728162911
- Pages: 662 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2020 )