Details
- Title: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2019)
- Date/Location: Held 21-23 October 2019, Hangzhou, China.
- IEEE #: CFP1948P-POD
- ISBN: 9781728142630
- Pages: 306 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2019)
- Date/Location: Held 21-23 October 2019, Hangzhou, China.
- IEEE #: CFP1948P-POD
- ISBN: 9781728142630
- Pages: 306 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )