Details
- Title: 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2019)
- Date/Location: Held 20-21 April 2019, Hangzhou, China.
- IEEE #: CFP19M95-POD
- ISBN: 9781538679999
- Pages: 239 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2019)
- Date/Location: Held 20-21 April 2019, Hangzhou, China.
- IEEE #: CFP19M95-POD
- ISBN: 9781538679999
- Pages: 239 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )