ELECTROMAGNETIC COMPATIBILITY, SAPPORO. JOINT INTERNATIONAL SYMPOSIUM. 2019. (EMC SAPPORO/APEMC 2019) (AND ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY)

ELECTROMAGNETIC COMPATIBILITY, SAPPORO. JOINT INTERNATIONAL SYMPOSIUM. 2019. (EMC SAPPORO/APEMC 2019) (AND ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY)

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051121
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  • Title: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC 2019)
  • Date/Location: Held 3-7 June 2019, Sapporo, Japan.
  • IEEE #: CFP19EMJ-POD
  • ISBN: 9781728116396
  • Pages: 819 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2020 )

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  • Title: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC 2019)
  • Date/Location: Held 3-7 June 2019, Sapporo, Japan.
  • IEEE #: CFP19EMJ-POD
  • ISBN: 9781728116396
  • Pages: 819 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2020 )