Details
- Title: 2019 International Conference on Deep Learning and Machine Learning in Emerging Applications (Deep-ML 2019)
- Date/Location: Held 26-28 August 2019, Istanbul, Turkey.
- IEEE #: CFP19U93-POD
- ISBN: 9781728129150
- Pages: 79 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 International Conference on Deep Learning and Machine Learning in Emerging Applications (Deep-ML 2019)
- Date/Location: Held 26-28 August 2019, Istanbul, Turkey.
- IEEE #: CFP19U93-POD
- ISBN: 9781728129150
- Pages: 79 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )