Details
- Title: 2019 IEEE Hot Chips 31 Symposium (HCS 2019)
- Date/Location: Held 18-20 August 2019, Cupertino, California, USA.
- IEEE #: CFP19HCS-POD
- ISBN: 9781728120904
- Pages: 394 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Hot Chips 31 Symposium (HCS 2019)
- Date/Location: Held 18-20 August 2019, Cupertino, California, USA.
- IEEE #: CFP19HCS-POD
- ISBN: 9781728120904
- Pages: 394 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2020 )