Details
- Title: 2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2019)
- Date/Location: Held 12-14 August 2019, Lima, Peru.
- IEEE #: CFP19D62-POD
- ISBN: 9781728136479
- Pages: 283 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2019)
- Date/Location: Held 12-14 August 2019, Lima, Peru.
- IEEE #: CFP19D62-POD
- ISBN: 9781728136479
- Pages: 283 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )