Details
- Title: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2019)
- Date/Location: Held 22-26 July 2019, New Orleans, Louisiana, USA.
- IEEE #: CFP19EMC-POD
- ISBN: 9781538692004
- Pages: 669 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2019)
- Date/Location: Held 22-26 July 2019, New Orleans, Louisiana, USA.
- IEEE #: CFP19EMC-POD
- ISBN: 9781538692004
- Pages: 669 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )