Details
- Title: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019)
- Date/Location: Held 7-10 July 2019, Glasgow, United Kingdom.
- IEEE #: CFP19T72-POD
- ISBN: 9781538693056
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019)
- Date/Location: Held 7-10 July 2019, Glasgow, United Kingdom.
- IEEE #: CFP19T72-POD
- ISBN: 9781538693056
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )