Details
- Title: 2019 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPCON 2019)
- Date/Location: Held 4-9 April 2019, Newark, California, USA.
- IEEE #: CFP19S63-POD
- ISBN: 9781728112657
- Pages: 189 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPCON 2019)
- Date/Location: Held 4-9 April 2019, Newark, California, USA.
- IEEE #: CFP19S63-POD
- ISBN: 9781728112657
- Pages: 189 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )