Details
- Title: 2019 Compound Semiconductor Week (CSW 2019)
- Date/Location: Held 19-23 May 2019, Nara, Japan.
- IEEE #: CFP19IIP-POD
- ISBN: 9781728100814
- Pages: 486 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 Compound Semiconductor Week (CSW 2019)
- Date/Location: Held 19-23 May 2019, Nara, Japan.
- IEEE #: CFP19IIP-POD
- ISBN: 9781728100814
- Pages: 486 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )