Details
- Title: 2019 Devices for Integrated Circuit (DevIC 2019)
- Date/Location: Held 23-24 March 2019, Kalyani, India.
- IEEE #: CFP19K13-POD
- ISBN: 9781538667231
- Pages: 542 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 Devices for Integrated Circuit (DevIC 2019)
- Date/Location: Held 23-24 March 2019, Kalyani, India.
- IEEE #: CFP19K13-POD
- ISBN: 9781538667231
- Pages: 542 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )