Details
- Title: 2019 IEEE International Systems Conference (SysCon 2019)
- Date/Location: Held 8-11 April 2019, Orlando, Florida, USA.
- IEEE #: CFP19SYT-POD
- ISBN: 9781538683972
- Pages: 976 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE International Systems Conference (SysCon 2019)
- Date/Location: Held 8-11 April 2019, Orlando, Florida, USA.
- IEEE #: CFP19SYT-POD
- ISBN: 9781538683972
- Pages: 976 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2019 )