Details
- Title: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2019)
- Date/Location: Held 11-13 June 2019, Copenhagen, Denmark.
- IEEE #: CFP19M25-POD
- ISBN: 9781728128849
- Pages: 28 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2019)
- Date/Location: Held 11-13 June 2019, Copenhagen, Denmark.
- IEEE #: CFP19M25-POD
- ISBN: 9781728128849
- Pages: 28 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )