Details
- Title: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2019)
- Date/Location: Held 12-15 May 2019, Paris, France.
- IEEE #: CFP19DTI-USB
- ISBN: 9781728132877
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2019)
- Date/Location: Held 12-15 May 2019, Paris, France.
- IEEE #: CFP19DTI-USB
- ISBN: 9781728132877
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )