Details
- Title: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2019)
- Date/Location: Held 12-15 May 2019, Paris, France.
- IEEE #: CFP19DTI-POD
- ISBN: 9781728132570
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2019)
- Date/Location: Held 12-15 May 2019, Paris, France.
- IEEE #: CFP19DTI-POD
- ISBN: 9781728132570
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )