THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 18TH 2019. (ITherm 2019) (2 VOLS)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 18TH 2019. (ITherm 2019) (2 VOLS)

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049495
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Details

  • Title: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019)
  • Date/Location: Held 28-31 May 2019, Las Vegas, Nevada, USA.
  • IEEE #: CFP19ITH-POD
  • ISBN: 9781728124629
  • Pages: 1,363 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2019 )

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  • Title: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2019)
  • Date/Location: Held 28-31 May 2019, Las Vegas, Nevada, USA.
  • IEEE #: CFP19ITH-POD
  • ISBN: 9781728124629
  • Pages: 1,363 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2019 )