Details
- Title: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD 2019)
- Date/Location: Held 19-23 May 2019, Shanghai, China.
- IEEE #: CFP19ISP-POD
- ISBN: 9781728105826
- Pages: 566 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD 2019)
- Date/Location: Held 19-23 May 2019, Shanghai, China.
- IEEE #: CFP19ISP-POD
- ISBN: 9781728105826
- Pages: 566 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2019 )