Details
- Title: 2019 International Conference on Electronics Packaging (ICEP 2019)
- Date/Location: Held 17-20 April 2019, Niigata, Japan.
- IEEE #: CFP1989U-POD
- ISBN: 9781728117102
- Pages: 452 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 International Conference on Electronics Packaging (ICEP 2019)
- Date/Location: Held 17-20 April 2019, Niigata, Japan.
- IEEE #: CFP1989U-POD
- ISBN: 9781728117102
- Pages: 452 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2019 )