Details
- Title: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)
- Date/Location: Held 21-25 May 2019, Kanazawa, Japan.
- IEEE #: CFP1918S-POD
- ISBN: 9781728103877
- Pages: 90 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)
- Date/Location: Held 21-25 May 2019, Kanazawa, Japan.
- IEEE #: CFP1918S-POD
- ISBN: 9781728103877
- Pages: 90 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2019 )