THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 20TH 2019. (EuroSimE 2019) (USB)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 20TH 2019. (EuroSimE 2019) (USB)

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048912
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  • Title: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)
  • Date/Location: Held 24-27 March 2019, Hannover, Germany.
  • IEEE #: CFP19566-USB
  • ISBN: 9781538680391
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2019 )

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  • Title: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019)
  • Date/Location: Held 24-27 March 2019, Hannover, Germany.
  • IEEE #: CFP19566-USB
  • ISBN: 9781538680391
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2019 )