Details
- Title: 2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2019)
- Date/Location: Held 17-19 April 2019, Yokohama, Japan.
- IEEE #: CFP19COL-USB
- ISBN: 9781728117485
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2019)
- Date/Location: Held 17-19 April 2019, Yokohama, Japan.
- IEEE #: CFP19COL-USB
- ISBN: 9781728117485
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2019 )