Details
- Title: 2019 Pan Pacific Microelectronics Symposium (Pan Pacific 2019)
- Date/Location: Held 11-14 February 2019, Kauai, Hawaii, USA.
- IEEE #: CFP19B91-POD
- ISBN: 9781728136295
- Pages: 229 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 Pan Pacific Microelectronics Symposium (Pan Pacific 2019)
- Date/Location: Held 11-14 February 2019, Kauai, Hawaii, USA.
- IEEE #: CFP19B91-POD
- ISBN: 9781728136295
- Pages: 229 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )