Details
- Title: 2019 3rd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom 2019)
- Date/Location: Held 21-22 March 2019, Hanoi, Vietnam.
- IEEE #: CFP19G02-POD
- ISBN: 9781538679647
- Pages: 180 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 3rd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom 2019)
- Date/Location: Held 21-22 March 2019, Hanoi, Vietnam.
- IEEE #: CFP19G02-POD
- ISBN: 9781538679647
- Pages: 180 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2019 )