Details
- Title: 2019 IEEE 1st International Workshop on Intelligent Bug Fixing (IBF 2019)
- Date/Location: Held 24 February 2019, Hangzhou, China.
- IEEE #: CFP19T66-POD
- ISBN: 9781728118109
- Pages: 44 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 1st International Workshop on Intelligent Bug Fixing (IBF 2019)
- Date/Location: Held 24 February 2019, Hangzhou, China.
- IEEE #: CFP19T66-POD
- ISBN: 9781728118109
- Pages: 44 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2019 )