DESIGN, ENGINEERING AND COMPUTER SCIENCES. INTERNATIONAL CONFERENCE. 2018.

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042501
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  • Title: International Conference on Design, Engineering and Computer Sciences 2018
  • Date/Location: Held 9 August 2018, Jakarta, Indonesia.
  • Series: IOP Conference Series: Materials Science and Engineering Volume 453
  • Editor: Adriansyah, A. et al.
  • ISBN: 9781510876644
  • Pages: 621 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )

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  • Title: International Conference on Design, Engineering and Computer Sciences 2018
  • Date/Location: Held 9 August 2018, Jakarta, Indonesia.
  • Series: IOP Conference Series: Materials Science and Engineering Volume 453
  • Editor: Adriansyah, A. et al.
  • ISBN: 9781510876644
  • Pages: 621 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Apr 2019 )