MATERIALS, FORMULATION, AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING, AND HIGH DENSITY INTERCONNECTION PCB. (AIMES 2018)

MATERIALS, FORMULATION, AND PROCESSES FOR SEMICONDUCTOR, 2.5 AND 3D CHIP PACKAGING, AND HIGH DENSITY INTERCONNECTION PCB. (AIMES 2018)

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041214
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  • Title: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
  • Subtitle: AiMES 2018
  • Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
  • Series: ECS Transactions Volume 86 No.08
  • Editor: Dow, W.-P. et al.
  • ISBN: 9781510871687
  • Pages: 49 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Oct 2018 )

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  • Title: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
  • Subtitle: AiMES 2018
  • Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
  • Series: ECS Transactions Volume 86 No.08
  • Editor: Dow, W.-P. et al.
  • ISBN: 9781510871687
  • Pages: 49 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Oct 2018 )