Details
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 15
- Subtitle: AiMES 2018
- Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
- Series: ECS Transactions Volume 86 No.05
- Editor: Tan, C. S. et al.
- ISBN: 9781510871656
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 15
- Subtitle: AiMES 2018
- Date/Location: Held 30 September - 4 October 2018, Cancun, Mexico.
- Series: ECS Transactions Volume 86 No.05
- Editor: Tan, C. S. et al.
- ISBN: 9781510871656
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Oct 2018 )