MICROTECHNOLOGY AND THERMAL PROBLEMS IN ELECTRONICS. INTERNATIONAL CONFERENCE. 2017. (MICROTHERM 2017) (AND INTERNATIONAL CONFERENCE SMART ENGINEERING OF NEW MATERIALS, SENM 2017) (SEMTHERM 2017)

MICROTECHNOLOGY AND THERMAL PROBLEMS IN ELECTRONICS. INTERNATIONAL CONFERENCE. 2017. (MICROTHERM 2017) (AND INTERNATIONAL CONFERENCE SMART ENGINEERING OF NEW MATERIALS, SENM 2017) (SEMTHERM 2017)

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  • Title: SEMTherm 2017: International Conference on Microtechnology & Thermal Problems in Electronics (MICROTHERM 2017) and International Conference on Smart Engineering of New Materials (SENM 2017)
  • Date/Location: Held 26-29 June 2017, Lodz, Poland.
  • Series: Journal of Physics: Conference Series Volume 1033
  • Editor: Raj, E. et al.
  • ISBN: 9781510864085
  • Pages: 89 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2018 )

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  • Title: SEMTherm 2017: International Conference on Microtechnology & Thermal Problems in Electronics (MICROTHERM 2017) and International Conference on Smart Engineering of New Materials (SENM 2017)
  • Date/Location: Held 26-29 June 2017, Lodz, Poland.
  • Series: Journal of Physics: Conference Series Volume 1033
  • Editor: Raj, E. et al.
  • ISBN: 9781510864085
  • Pages: 89 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2018 )