Details
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8
- Subtitle: 233rd ECS Meeting
- Date/Location: Held 13-17 May 2018, Seattle, Washington, USA.
- Series: ECS Transactions Volume 85 No.06
- Editor: Roozeboom, F. et al.
- ISBN: 9781607688341
- Pages: 178 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 8
- Subtitle: 233rd ECS Meeting
- Date/Location: Held 13-17 May 2018, Seattle, Washington, USA.
- Series: ECS Transactions Volume 85 No.06
- Editor: Roozeboom, F. et al.
- ISBN: 9781607688341
- Pages: 178 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )