Details
- Title: 2018 IEEE Haptics Symposium (HAPTICS 2018)
- Date/Location: Held 25-28 March 2018, San Francisco, California, USA.
- IEEE #: CFP18317-POD
- ISBN: 9781538654255
- Pages: 357 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Haptics Symposium (HAPTICS 2018)
- Date/Location: Held 25-28 March 2018, San Francisco, California, USA.
- IEEE #: CFP18317-POD
- ISBN: 9781538654255
- Pages: 357 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )