Details
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4
- Subtitle: 222nd ECS Meeting/PRiME 2012
- Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 50 No.32
- Editor: Kondo, K. et al.
- ISBN: 9781623320683
- Pages: 83 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Apr 2018 )
Description
Members/Attendees
Tab 4
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4
- Subtitle: 222nd ECS Meeting/PRiME 2012
- Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 50 No.32
- Editor: Kondo, K. et al.
- ISBN: 9781623320683
- Pages: 83 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Apr 2018 )