Details
- Title: Semiconductor Wafer Bonding 12: Science, Technology, and Applications
- Subtitle: 222nd ECS Meeting/PRiME 2012
- Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 50 No.7
- Editor: Goorsky, M. S. et al.
- ISBN: 9781623320065
- Pages: 409 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jan 2018 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding 12: Science, Technology, and Applications
- Subtitle: 222nd ECS Meeting/PRiME 2012
- Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 50 No.7
- Editor: Goorsky, M. S. et al.
- ISBN: 9781623320065
- Pages: 409 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jan 2018 )