SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 2. (221ST ECS MEETING)

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036979
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  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 2
  • Subtitle: 221st ECS Meeting
  • Date/Location: Held 6-10 May 2012, Seattle, Washington, USA.
  • Series: ECS Transactions Volume 45 No.06
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781566779586
  • Pages: 265 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Dec 2017 )

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  • Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 2
  • Subtitle: 221st ECS Meeting
  • Date/Location: Held 6-10 May 2012, Seattle, Washington, USA.
  • Series: ECS Transactions Volume 45 No.06
  • Editor: Roozeboom, F. et al.
  • ISBN: 9781566779586
  • Pages: 265 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Dec 2017 )