Details
- Title: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
- Subtitle: 224th ECS Meeting
- Date/Location: Held 27 October - 1 November 2013, San Francisco, California, USA.
- Series: ECS Transactions Volume 58 No.17
- Editor: Misra, D.
- ISBN: 9781623321406
- Pages: 110 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )
Description
Members/Attendees
Tab 4
- Title: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
- Subtitle: 224th ECS Meeting
- Date/Location: Held 27 October - 1 November 2013, San Francisco, California, USA.
- Series: ECS Transactions Volume 58 No.17
- Editor: Misra, D.
- ISBN: 9781623321406
- Pages: 110 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )