Details
- Title: Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gosele
- Subtitle: 218th ECS Meeting
- Date/Location: Held 10-15 October 2010, Las Vegas, Nevada, USA.
- Series: ECS Transactions Volume 33 No.04
- Editor: Colinge, C. et al.
- ISBN: 9781607681731
- Pages: 640 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gosele
- Subtitle: 218th ECS Meeting
- Date/Location: Held 10-15 October 2010, Las Vegas, Nevada, USA.
- Series: ECS Transactions Volume 33 No.04
- Editor: Colinge, C. et al.
- ISBN: 9781607681731
- Pages: 640 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )