Details
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
- Subtitle: 231st ECS Meeting
- Date/Location: Held 28 May - 1 June 2017, New Orleans, Louisiana, USA.
- Series: ECS Transactions Volume 77 No.05
- Editor: Roozeboom, F. et al.
- ISBN: 9781607688082
- Pages: 269 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )
Description
Members/Attendees
Tab 4
- Title: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
- Subtitle: 231st ECS Meeting
- Date/Location: Held 28 May - 1 June 2017, New Orleans, Louisiana, USA.
- Series: ECS Transactions Volume 77 No.05
- Editor: Roozeboom, F. et al.
- ISBN: 9781607688082
- Pages: 269 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Jun 2017 )